Wildcat+ 640 短波紅外相機可在640 x 512分辨率下實現300 Hz的幀速率，高速成像 。 這款攝像機配備 工業標準CameraLink或USB3.0 接口，能夠以全幀速率進行 數據傳輸。 在窗口模式下，其幀速率 還可提高。Wildcat+ 640 短波紅外相機系列可作為整套攝像機產品提供，并配備內置 圖像處理功能和熱電 穩定功能，以獲得低暗電流和 優化的噪音性能， 從而最終實現的圖像質量。 20 μm像素尺寸 使得Wildcat+ 640短波紅外相機可兼容 更多的C頭以及其他 低成本鏡頭。
Wildcat+ 640系列 短波紅外相機基于的InGaAs探測器，640x512像素，20 μm像素間距。該相機提供了的高分辨率SWIR成像能力，配備了多功能的、經過行業驗證的Wildcat相機包(符合GenICam)，并提供的機載圖像處理。 Wildcat+ 640 短波紅外相機 通過CameraLink或USB3 Vision接口輸出高達300hz的全幀圖像。
相機特點：
Wildcat+ 640系列高分辨率SWIR成像相機接口 可選CL或USB3 Vision接口的
?640x512像素
?20 μm像素間距
?usb3 Vision, CameraLink
設計用于
半導體晶片及太陽能晶圓片檢驗
科學與高級研究
顯示器檢查——手機和電視
顯微鏡
激光束分析
優勢
緊湊和經過工業驗證的相機設計
高分辨率SWIR成像
的機載圖像處理性能
GenlCam兼容
靈活的光學安裝和鏡頭選項
WILDCAT+ 640 SERIES
High resolution SWIR imaging camera with CL or USB3 Vision interface
640x512 pixels
20 μm pixel pitch
USB3 Vision, CameraLink
HIGH-RESOLUTION, SWIR CAMERA
The Wildcat+ 640 series is based upon a state-of-the-art InGaAs detector with 640x512 pixels and 20 μm pixel pitch. The camera offers superior, high resolution SWIR imaging capabilities, comes in a versatile and industry-proven Wildcat camera package (GenICam compliant) and offers advanced on-board image processing.
The Wildcat+ 640 camera outputs full frame images up to 300 Hz via either a CameraLink or USB3 Vision interface.
DESIGNED FOR USE IN
Semiconductor chip and solar wafer inspection
Scientific & Advanced Research
Display inspection - mobile phone & TV
Microscopy
Laser beam analysis
ADVANTAGES
Compact and industry-proven camera design
High-resolution SWIR imaging
Advanced on-board image processing performance
GenlCam compliant
Flexible optical mount and lens options
注：產品信息若有變更恕不另行通知 / 比利時Xenics公司中國代理商---元奧儀器
產品參數：
型號 | Wildcat+ 640 CL 300 | Wildcat+ 640 U3V 300 | ||
Mechanical specifications | ||||
Camera dimensions (width x height x length) [mm] (approx.) | 55 x 55 x 72 | 55 x 55 x 91.5 | ||
Optical interface | C-mount or M42 | |||
Camera weight [gr] | 316 | 358 | ||
Connector USB | NA | USB 3.0 type micro-B | ||
Connector CameraLink | Standard SDR | NA | ||
Connector power | Unified connector (Lemo 1B) | |||
Connector trigger | Unified connector (Lemo 1B) | |||
Connector general I/O | Unified connector (Lemo 1B) | |||
Environmental & power specifications | ||||
Operating temperature range (housing temperature) [°C] | From -40 to +70 | |||
Storage temperature [°C] | From -40 to +85 | |||
Power consumption [W] | <7 | |||
Power supply voltage | DC 12 V | |||
Shock | 40g, 11ms, according to MIL-STD810G | |||
Vibration | 5g (20 to 2000 Hz), according to MIL-STD810G | |||
IP rating | IP40 | |||
Regulatory compliance | CE | |||
Electro-optical specifications | ||||
Image format [pixels] | 640x512 | |||
Pixel pitch [μm] | 20 | |||
Detector type | InGaAs photodiode array with CTIA ROIC | |||
Sensor temperature stabilization | TE-cooler | |||
Integration type | Snapshot - Global Shutter | |||
Active area and diagonal [mm] | 12.8 x 10.24 (diagonal 16.4) | |||
Optical fill factor | 99% | |||
Spectral range [nm] | 900 - 1700 | |||
Quantum efficiency | ~80% (typical peak value) | |||
Gain modes | High Gain (HG) & High Dynamic Range mode (HDR) | |||
Full well capacities [electrons] | 65k (HG) & 550k (HDR) | |||
Read noise [electrons] | 45 (HG) & 200 (HDR) | |||
Dark current [electrons/second] | < 100k | |||
Read out modes | ITR/IWR | |||
Pixel operability | >99.5% | |||
Preconfigured exposure time range [ms] | HDR ITR: 0.5 ms; HG ITR: 0.5 ms & 5 ms; HG IWR 0.5 ms & 3 ms | |||
Max frame rate [Hz] (full frame) | 300 | 300 | ||
Region of interest | Yes | |||
Min region size [pixels] | 8 x 8 (step size 4 pixels in X & 1 pixel in Y) | |||
Max frame rate [Hz] (min region size) | >7 kHz | |||
Commａnd and control | CameraLink Base | USB3 Vision | ||
Digital output format | CameraLink Base (16 bit) | USB3 Vision (16 bit) | ||
Trigger | Connector: 2 trigger in & 2 trigger out - LVCMOS 3.3 V; CameraLink trigger in | Connector: 2 trigger in & 2 trigger out - LVCMOS 3.3 V; CameraLink trigger in | ||
Product selector guide | ||||
Part number | XEN-000874 | XEN-000873 | ||
注：產品信息若有變更恕不另行通知 / 比利時Xenics公司中國代理商---元奧儀器
應用領域：
食品檢測
半導體檢測
SWIR相機能夠穿透硅材料
廢品分析
廢品分揀
適合高光譜成像，半導體行業檢測，激光光束分析等應用。
注：產品信息若有變更恕不另行通知 / 比利時Xenics公司中國代理商---元奧儀器
