SYSTEM BENEFITS
? Compact Flexible Solution for High Throughput Reliability Verification and Test
? Handles full wafer, panel, singulated die and module applications
? Identifies failing logic, memory and photonic die before final package integration
? High power thermal chuck dual Blade (slot) capability using WaferPakTM contactors or DiePak®
carriers (for singulated die and modules)
? Cost-Effective Solution for High Power Wafer/Die/Module Verification and Test
? Configurable channel resources per Blade: Universal Channel Modules, High Voltage Channel
Modules or High Current Channel Modules
? Up to 2,048 “Universal Channel” resources: (I/O, Clock, PPMU or DPS) per Blade with deep
scan, pattern data and capture memory for testing of devices with BIST or DFT capabilities
? Up to 1,024 high voltage (29 V) or high current (2 A) sources resources per Blade
? Production Proven Full-Wafer Reliability Verification & Test Solution
? Reduces test costs by functionally testing wafers, die or modules during reliability verification
? Offers a total solution when configured with a WaferPak contactor, DiePak carrier, Wafer
Aligner and DiePak Loader
? Protects devices with individual per channel over-current and over-voltage protection